BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//GSAS Micro Systems//Events//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
UID:webinar-siemens-ucie-chiplet-design-2026@gsasindia.com
DTSTAMP:20261202T160000Z
DTSTART:20261202T160000Z
DTEND:20261202T170000Z
TRANSP:OPAQUE
SUMMARY:Siemens EDA: Chiplet-to-Chiplet Design with UCIe
DESCRIPTION:Siemens EDA webinar on die-to-die design with UCIe: rapid packa
 ge assembly pathfinding\, PPA optimization\, shift-left analysis and simul
 ation-to-silicon correlation with the Innovator3D IC tools. GSAS highlight
 s this free webinar for Indian chiplet\, IC package and 3D IC teams.\n\nMo
 re info: https://gsasindia.com/events/webinar-siemens-ucie-chiplet-design-
 2026
LOCATION:Online\, free live webinar\, 9:30 PM IST
URL:https://gsasindia.com/events/webinar-siemens-ucie-chiplet-design-2026
STATUS:CONFIRMED
END:VEVENT
END:VCALENDAR