GSAS Partners with Elsyca for PCB Plating Simulation in India

GSAS Micro Systems has announced a partnership with Elsyca NV to bring advanced PCB plating and design-for-manufacturing simulation tools to India’s electronics and manufacturing sector.

About Elsyca

Elsyca provides simulation-driven tools for electrochemical processes, specifically copper plating optimization for PCB manufacturing. Their solutions help PCB designers and manufacturers predict plating outcomes before production, reducing waste and iterations.

Solutions Now Available Through GSAS

• PCBPlate: simulate copper thickness distribution across patterns, panels, and vias at the design stage
• PCBBalance: automated copper balancing for production-ready designs with fewer iterations
• PlatingManager: digital twin simulation of plating lines to predict and optimize manufacturing results
• IntelliTool: intelligent tooling optimization for plating process parameters

Why This Partnership Matters

Indian PCB manufacturers and design houses can now get early visibility into plating quality issues, before committing to expensive production runs. The result: reduced material waste, improved yield, and faster delivery cycles.

This partnership complements GSAS’s existing Siemens EDA portfolio (Xpedition, HyperLynx, Valor) by adding the electrochemical manufacturing simulation dimension that bridges the gap between PCB design and PCB fabrication.

Learn more about Elsyca | Request a demo

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