Schematic and architecture
From a block diagram to a production-ready netlist.
- Power tree and rail budgeting
- Component selection for cost and availability
- BOM optimisation and design-rule setup
Genesis Cortex-M4 Bridge, designed by GSAS in India
Capabilities · Hardware & PCB Design
Boards designed, built and verified, by a team that ships its own hardware.
Schematic through DFM-checked Gerbers, high-speed layout, signal and power integrity, and turn-key products from concept to production. Engineering led from Bengaluru, on Siemens Xpedition.
01 What we design
Six hardware services, one board at a time.
Each card lights the part of the board that service shapes, from the power tree to the revision label on a board already in the field.
- 1. Power tree: Schematic and architecture
- 2. BGA fan-out: Multilayer layout
- 3. High-speed link: Signal and power integrity
- 4. Panel and fiducials: DFM and DFA review
- 5. Housing and I/O: Turn-key development
- 6. Revision label: Production support
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Multilayer PCB layout
Dense, constraint-driven multilayer layout.
- Controlled impedance and differential pairs
- BGA fan-out, power planes, via optimisation
- DRC-clean Gerber and fabrication output
2-layer prototypes to 24-layer production boards
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Signal and power integrity
High-speed problems found on screen, not on the bench.
- Pre- and post-layout SI, reflections, crosstalk
- PDN impedance and decoupling optimisation
- Eye-diagram checks on high-speed interfaces
Analysed in Siemens HyperLynx
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DFM and DFA review
A design that a fab and an assembly line can build at yield.
- Padstack and solder-paste aperture review
- Panelisation and testability analysis
- Fabrication constraint validation
Checked in Siemens Valor NPI before fabrication
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Turn-key product development
Concept to a built and tested product, with documentation.
- System architecture through prototype build
- Board test and integration into the housing
- Production handoff with complete documentation
Sun, Earth and star sensors delivered for ISRO, 2016 to 2019
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Production support
Engineering that stays with the board after it ships.
- ECO management and re-spins
- Component obsolescence mitigation
- Yield work and field failure analysis
Behind GSAS’s own range of boards and instruments
02 How we work
From stack-up to a board that passes test.
Design and analysis on the same tools GSAS supplies, build and board-level verification in-house, PCB fabrication through qualified partners.
The stack-up comes first
Impedance, return paths and the power delivery network are decided in the stack-up, before a single trace is routed.
So the stack-up is designed with the layout: signal layers paired with solid reference planes, split power rails placed for the PDN, and every high-speed net checked in HyperLynx before release.
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01
Design
- Schematic
- architecture, power tree, BOM
- Layout
- multilayer, controlled impedance
- Analysis
- SI, PI and DFM before release
- Tool chain
- Siemens Xpedition, HyperLynx, Valor NPI
Designed on the tools GSAS supplies and supports
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02
Build
- Parts
- screening, counterfeit IC detection
- Assembly
- SMD/PTH hand soldering, staking
- Protection
- coating and potting
- PCB fabrication
- qualified partners
Build and test site at Doddaballapur, opened 2026
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03
Verify
- Board test
- functional, select-on-test
- Diagnostics
- FADOS board testers
- Integration
- card stack and housing
- Instruments
- GW Instek, Pico Technology
Checkout systems built for ISRO
- Half-acre build and test site, Bengaluru Rural, opened 2026
- Doddaballapur
- Specialists, engineering led from Bengaluru
- 40+
- In 9 Indian cities
- 11 offices
- Certified by TÜV Rheinland
- ISO 9001:2015
Related: FPGA design · Embedded software · Testing and validation · Space and satellite
03 Hardware we built
GSAS designs boards under its own name.
The best evidence of a hardware team is the hardware. These are boards and instruments GSAS designed and builds, and the sensor work it delivered for ISRO.
Genesis series · Board 01
One carrier that brings a real project’s peripherals onto one board.
- MCU
- STM32F407 Cortex-M4 carrier
- Connectivity
- 10/100 Ethernet, CAN, three RF slots
- Motion and HMI
- Stepper drive, TFT header, keypad
- Status
- Fabricated, shown at electronica India 2026
ISRO · 2016 to 2024
Sun, Earth and star sensors delivered for ISRO between 2016 and 2019, and hardware and test systems for Chandrayaan-3 and Aditya-L1. Through its founding team, GSAS has supported ISRO since the 1990s.
The space programme work →As a valuable industry partner, you have … significantly contributed in the realization of hardware and testing of systems as per the schedule.
The GSAS range
All GSAS products →- Genesis Cortex-M4 Bridge STM32F407 carrier, Ethernet, CAN, RF slots
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LPC 1768 development board Arm Cortex-M3, on-board JTAG/SWD -
LPC 2929 development board ARM9 evaluation platform -
USB-JTAG debugger Debug and trace -
Digital IC tester Board diagnostics -
PCI-DIO card 48 digital I/O lines, now discontinued
04 Working together
Three ways to start, depending on where your board is.
A requirement on paper, a design waiting for release, or a product idea. Pick the one that fits.
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01
Design to your spec
You have the requirements
Send the block diagram or the requirement. GSAS takes it through schematic, layout and analysis to a released, DFM-checked data pack your fab and assembler can build.
- Schematic and BOM
- Multilayer layout and Gerbers
- SI, PI and DFM sign-off
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02
Review a design you have
Before you release it
A second set of eyes on an existing board: signal and power integrity on the high-speed nets, and a DFM and DFA review against your fab’s rules. If it needs a re-spin, GSAS can take it on.
- SI and PI review
- DFM and DFA review
- Re-spin and ECOs
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03
Concept to product
Turn-key development
One partner from architecture to a built and tested product: design, prototype build, board test and integration into the housing, then production handoff with complete documentation.
- Architecture to prototype
- Build and board test
- Production handoff and support
05 Contact
Have a board to design or rescue?
Tell us what the board has to do, or send the design you have. GSAS replies from Bengaluru with scope and a proposal: schematic, layout, analysis, build and test.
Questions
Hardware design and PCB engineering with GSAS in India
What hardware design services does GSAS offer in India?
Schematic capture and architecture, multilayer PCB layout, signal and power integrity analysis, DFM and DFA review, turn-key product development from concept to a built and tested product, and production support (ECOs, obsolescence, re-spins, yield and field failure analysis). Engineering is led from Bengaluru.
Which EDA tools does GSAS design on?
Siemens EDA: Xpedition for schematic and layout, HyperLynx for signal and power integrity, and Valor NPI for DFM. These are the same tools GSAS supplies and supports for engineering teams in India.
How many layers can GSAS lay out?
From 2-layer prototypes to 24-layer production boards, with controlled impedance, differential pairs, BGA fan-out and power plane design.
Does GSAS build the boards it designs?
GSAS covers parts screening and counterfeit IC detection, SMD and PTH hand soldering, staking, coating, potting and board-level test at its build and test site at Doddaballapur, Bengaluru Rural. PCB fabrication is done through qualified partners.
Can GSAS review a design we already have?
Yes. A signal and power integrity review, or a DFM and DFA review, can be run on an existing design before you release it to fabrication, and GSAS can take on the re-spin if one is needed.
What hardware has GSAS itself designed?
GSAS designs and builds its own range, including the Genesis Cortex-M4 Bridge, LPC 1768 and LPC 2929 development boards, a PCI digital I/O card (since discontinued), a USB-JTAG debugger and a digital IC tester. Through its founding team, it has supported ISRO since the 1990s, including sun, Earth and star sensors delivered between 2016 and 2019.
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