FloTHERM

FloTHERM from Siemens EDA is the industry-standard CFD-based thermal simulation tool purpose-built for electronics cooling analysis. Unlike general-purpose CFD tools, FloTHERM is optimized specifically for the thermal challenges of electronic systems, from individual IC packages through PCB assemblies to complete system enclosures with fans, heatsinks, and ventilation. Its SmartPart technology provides a library of pre-characterized thermal models for common electronic components, enabling rapid model building without requiring detailed internal package geometry.

FloTHERM solves the conjugate heat transfer problem across the full electronics hierarchy. At the component level, it predicts junction temperatures and thermal resistance paths within IC packages. At the board level, it models conduction through copper layers, convection from board surfaces, and radiation exchange between components. At the system level, it simulates airflow through enclosures, fan performance curves, heatsink optimization, and thermal interface material (TIM) selection. The what-if analysis capability enables designers to rapidly compare cooling alternatives, different heatsink geometries, fan speeds, vent configurations, and TIM materials, before committing to physical prototypes.

Capability	Detail
Component Thermal	Junction temperature, thermal resistance prediction
Board Thermal	Copper-aware conduction, convection, radiation
System Thermal	Enclosure airflow, fan curves, vent optimization
SmartParts	Pre-characterized component thermal models
ECAD Import	Xpedition, PADS, ODB++ with detailed copper geometry
MCAD Import	NX, Creo, STEP, IGES for enclosure and heatsink geometry
Command Center	Design-of-experiments and optimization workflows
FloTHERM XT	CAD-centric variant with Parasolid geometry engine

FloTHERM is widely used in telecom infrastructure, automotive electronics, consumer devices, aerospace avionics, and industrial controls, any application where thermal management determines product reliability and lifetime. The ECAD-to-thermal workflow imports PCB layouts with full copper detail, ensuring that thermal simulations reflect the actual heat spreading paths in the board.

GSAS Micro Systems provides FloTHERM licensing and technical support for electronics thermal engineering teams across India, with expertise in thermal simulation methodology, ECAD/MCAD integration, and cooling solution optimization.