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ProMik Boundary Scan Suite
ProMik ProMik

Boundary Scan Suite

Testing & Verification

IEEE 1149.1 JTAG boundary scan for automated solder joint and interconnect fault detection with visual diagnostics. Authorized India partner, GSAS Micro Systems.

Standard

IEEE 1149.1 (JTAG)

Input Formats

ODB++, Gerber, BSDL, BOM

Diagnostics

Pin-level with board overlay

Max Chain

Unlimited (tested to 64 devices)

Platform

Windows 10/11

Authorized partner since 2011
Local FAE & application engineering
Hands-on training & integration
Manufacturer warranty

About Boundary Scan Suite

The ProMik Boundary Scan Suite provides automated IEEE 1149.1 JTAG boundary scan testing for solder joint and interconnect fault detection. Tests are auto-generated from ODB++, BSDL, and BOM data with minimal manual effort, while automatic IC detection builds the scan chain and identifies all JTAG-compliant components on the board.

Boundary scan

JTAG Test Types

Test TypeDescription
Infrastructure TestJTAG chain integrity and TAP controller verification
Interconnect TestNet-level solder joint verification between JTAG devices
Memory TestOn-board RAM/flash access via boundary scan cells
Cluster TestNon-JTAG device testing via adjacent JTAG-compliant ICs
Pin ToggleIndividual pin drive and sense for isolation testing
Short DetectionPin-to-pin and net-to-net short identification
Open DetectionBroken conductor and cold solder joint detection
Bridging DetectionSolder bridge identification on fine-pitch packages
Coverage AnalysisPer-net, per-pin, per-component test coverage reports
Visual DiagnosticsPin-level fault overlay on board image

Detailed coverage analysis reports show exactly which nets, pins, and components are tested, and pin-level diagnostics with visual board overlay enable fast root cause identification for solder defects, open circuits, shorts, and bridging. Full JTAG standard compliance with BSDL import for all major IC vendors, combined with integration into FlashTask Pro and automated test workflows, makes the Boundary Scan Suite essential for multi-layer PCB testing with fine-pitch BGA and QFP packages in automotive, aerospace, and contract manufacturing environments.

Boundary scan testing is increasingly important as PCB designs move to finer pitches, higher layer counts, and BGA packages where physical test probe access is limited or impossible. The Boundary Scan Suite’s ability to auto-generate tests from design data (ODB++ and BSDL files) reduces test development time compared to manual test creation, and the visual board overlay diagnostics help production operators quickly identify and communicate solder defects to rework stations.

Applications

  • Multi-layer PCB testing: automated solder joint verification for complex boards with 8+ layers and fine-pitch BGA packages
  • Automotive quality assurance: production-grade board testing for ECU manufacturing with pin-level fault traceability
  • Contract manufacturing: auto-generated test programs from ODB++ design data reduce test development time from weeks to hours
  • Incoming inspection: verify assembled boards against BOM and design intent before programming

ProMik Ecosystem

The Boundary Scan Suite runs on existing MSP hardware as a software license add-on. Combined with SMART ICT, it provides comprehensive board testing through programming interfaces. Test results integrate into FlashTask Pro traceability logging for complete production audit trails.

GSAS Micro Systems provides the Boundary Scan Suite with test strategy consulting, BSDL library assistance, and integration support for production teams implementing JTAG-based testing workflows.

Interested in Boundary Scan Suite?

Get pricing, an evaluation unit, or a technical consultation from our application engineers.

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