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Webinar

Multi-Board Systems: Rigid-Flex and ECAD-MCAD Co-Design

Part 4 of 5

Multi-Board Systems: Several Boards, One Enclosure

Main board, camera board and enclosure designed and checked as one system.

Multi-Board Systems: Rigid-Flex and ECAD-MCAD Co-Design, register to attend Save Your Seat →
Free registration
Date
Thursday, 7 January 2027
Format
Online, live webinar
Speakers
Ranjith Kumar Jadam, Sampath Radha Krishna & Bhavana Deevi (GSAS)
Cost
Free
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Registration for Multi-Board Systems: Rigid-Flex and ECAD-MCAD Co-Design is free and open online. Select Save Your Seat, or click the event image, to sign up.

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Drones, robots and smart cameras are several boards in a tight enclosure, and the electrical and mechanical teams have to stay in step. Part 4 covers system-level connectivity, rigid-flex design rules and working with mechanical teams in 3D.

This is Part 4 of 5 in the GSAS EDA Insights Series Webinars, PCB Design edition. Every session uses the same edge AI board, designed in Siemens Xpedition for the series, and includes a live demo.

What’s covered

  • System-level connectivity: a connector pin change made once and carried across the system.
  • Rigid-flex design rules, including flex bend zones, on a main board and camera board joined by a flex section.
  • ECAD-MCAD in 3D: an enclosure model imported and a collision caught before release.

Who should attend

PCB and hardware design engineers, mechanical engineers who work with PCB teams, and design leads on drone, robotics, camera and industrial products.

Session time

ItemDetail
DateThursday 7 January 2027
Time3:30 to 4:30 PM IST
Format50 minutes of presentation and live demo in Siemens Xpedition, then 10 minutes of Q&A
CostFree, registration required
RecordingSlides and recording emailed to all registrants after the session

Ranjith Kumar Jadam, Technical Director and Solution Architect, presents with Sampath Radha Krishna and Bhavana Deevi, Field Application Engineers. All three are from GSAS.

The full series

  1. AI in PCB Design: What Works Today and How Reliable It Is, Thu 3 Dec
  2. Why PCBs Respin and How to Stop It: Checks During Design, Thu 10 Dec
  3. Designing PCBs for Edge AI: DDR, PCIe and HDI, Thu 17 Dec
  4. Multi-Board Systems: Rigid-Flex and ECAD-MCAD Co-Design (this session)
  5. Moving from Altium or KiCad to Xpedition: What Transfers and What Changes, Thu 14 Jan

Each part has its own registration. Can’t make it live? Register anyway and we will send you the slides and the recording. For an overview of all five parts, see the series announcement.

Evaluating Xpedition for your team?

GSAS Micro Systems is a value added distributor/reseller for Siemens EDA in India, with a dedicated FAE team. Features vary by Xpedition edition and add-on, and GSAS can map each demo to the edition it needs. Talk to us about Xpedition Standard, Xpedition Advanced, Xpedition Enterprise or a guided evaluation for your project. Talk to our team.

Register for Multi-Board Systems: Rigid-Flex and ECAD-MCAD Co-Design

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More events

Other GSAS Events

Webinar

Moving from Altium or KiCad to Xpedition: What Transfers and What Changes

Thursday, 14 January 2027

Webinar

Designing PCBs for Edge AI: DDR, PCIe and HDI

Thursday, 17 December 2026

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AI-Assisted Embedded Development with the CMSIS Developer Assistant

Wednesday, 16 December 2026

Webinar

Why PCBs Respin and How to Stop It: Checks During Design

Thursday, 10 December 2026

FAQ

Frequently asked questions

When is Multi-Board Systems: Rigid-Flex and ECAD-MCAD Co-Design, in IST?
Thursday 7 January 2027, 3:30 to 4:30 PM IST. The presentation and live demo run 3:30 to 4:20 PM, and questions run 4:20 to 4:30 PM.
Do I need to register for each part of the series separately?
Yes. Each of the five parts has its own registration. Register for every part you want to attend. You receive a confirmation email with the joining link for each one.
Can I get the recording if I can't attend live?
Yes. Register anyway. After the session we email the slides and the recording to everyone who registered, whether or not they attended.
Who presents this session?
Ranjith Kumar Jadam, Technical Director and Solution Architect, with Sampath Radha Krishna and Bhavana Deevi, Field Application Engineers. All three are from GSAS Micro Systems, Siemens EDA partner in India.