Are these companies GSAS customers?

No. Every story in this article is a case study published by Siemens about its own customer. None of them describes work done by GSAS, and each section links to the Siemens original.

Which Siemens EDA tools appear most often in these case studies?

Xpedition appears in all ten stories, HyperLynx in six of them, and Valor in three (named as Valor NPI in two). Calibre 3DStack appears in the ETRI and Amkor chiplet packaging story.

Which Siemens case study reports a first-time-right PCB result?

Siemens' Leonardo case study lists the result as From 2 to 3 respins to right the first time innovation, and its Pleora Technologies case study lists First-pass design success.

Is there a Siemens EDA case study for medical device PCBs?

Yes. Siemens' Mindray case study covers high-density medical device boards designed in Xpedition that must meet ISO 13485, FDA and CFDA requirements, and lists the result as Increased design efficiency by 2X with less effort.

Can I buy the tools used in these case studies in India?

GSAS Micro Systems, an authorized Siemens EDA partner in India, supplies Xpedition, HyperLynx, Valor NPI, Calibre and Xpedition Package Designer, with local application engineers who run evaluations on your own designs. Other Siemens products named in the stories, such as Teamcenter and Simcenter Flotherm, are outside the range covered in this article.

Siemens EDA Customer Results: 10 Published Case Studies

Siemens has published customer case studies for its EDA tools from Leonardo, TESAT, NI, Chipletz, Abaco Systems, Pleora Technologies, Mindray, FANUC, Unison and ETRI with Amkor. This article summarises each one: who the customer is, which Siemens tools Siemens says they used, and the headline result as Siemens publishes it, with a link to the original.

A note on what this is and is not. These are Siemens’ published customer stories, not GSAS projects. The results are Siemens’ and its customers’ own accounts; we quote them as published and have not measured them ourselves. We collected them because Indian engineering managers evaluating Siemens EDA often ask the same question: who else uses these tools, on what kind of work, and what happened?

The Ten Stories at a Glance

Customer	Sector	Siemens tools named in the case study	Result, as Siemens publishes it
Leonardo (electronics division, Rome)	Defence and security electronics	Xpedition Enterprise, HyperLynx, HyperLynx DRC, HyperLynx Signal Integrity, Valor NPI	”From 2 to 3 respins to right the first time innovation”
TESAT	Satellite payloads	Xpedition Enterprise, HyperLynx	”Increased engineering productivity by 20 percent”
NI	Test and measurement	Xpedition flow, HyperLynx, Valor	”Increased productivity and met time-to-market goals”
Chipletz	Semiconductor packaging	Xpedition, HyperLynx	”Reduction of metal layers from 16 to 9”
Abaco Systems (AMETEK)	Rugged embedded computing	Xpedition Enterprise, HyperLynx, Valor NPI	”Reduced design cycles”
Pleora Technologies	Machine vision, aerospace and defence	Xpedition Enterprise, HyperLynx, Simcenter Flotherm	”First-pass design success”
Mindray	Medical devices	Xpedition	”Increased design efficiency by 2X with less effort”
FANUC	Factory automation	Xpedition (Xpedition EDM)	“Streamlined operations due to work-in-progress design data management”
Unison (a GE Aerospace company)	Aerospace engine controls	Xpedition Enterprise, Teamcenter	”Used process automation to reduce manual errors”
ETRI and Amkor Technology Korea	AI chiplet packaging	Xpedition Package Designer, Xpedition Substrate Integrator, Calibre 3DSTACK	”Integrated interposer and package substrate design flow”

PCB Design for Defence, Aerospace and Space

Leonardo: multi-board defence electronics

Siemens’ case study covers Leonardo’s electronics division in Rome, which designs systems for customers ranging from private companies to armed forces. The challenges Siemens lists are complex routing of many high-speed nets to FPGAs, matching layout to signal integrity analysis, and analysing power integrity and thermal behaviour together. Leonardo used Xpedition Enterprise with HyperLynx, HyperLynx DRC and Valor NPI. Siemens lists the result as “From 2 to 3 respins to right the first time innovation.”

Source: Siemens, Leonardo leverages Xpedition, HyperLynx and Valor

TESAT: satellite communication payloads

TESAT, headquartered in Backnang, Germany, builds telecommunication payload equipment for satellites and, in Siemens’ words, is “a technology leader in the field of laser communications.” Siemens’ case study describes the team adopting the Xpedition flow with HyperLynx to meet demand for higher functionality and density with fewer design iterations. Among the results Siemens lists: “Increased engineering productivity by 20 percent.”

Source: Siemens, TESAT case study

Abaco Systems (AMETEK): rugged embedded computing

Abaco Systems, acquired by AMETEK in 2021 according to the case study, builds rugged embedded computing products for defence and aerospace. Siemens’ story focuses on a geographically dispersed team, rising board complexity and compressed design cycles, addressed with Xpedition Enterprise, HyperLynx and Valor NPI. Siemens lists “Reduced design cycles” among the results.

Source: Siemens, Abaco Systems and AMETEK case study

Unison: engine controls for aerospace

Unison, which Siemens’ case study describes as a GE Aerospace company, provides engine controls and performance monitoring for aerospace, defence and space. The story is about connecting mechanical and electrical design through an NX and Xpedition Enterprise digital thread, with Teamcenter. Siemens lists the result “Used process automation to reduce manual errors.”

Source: Siemens, Unison case study

Pleora Technologies: first-pass design success

Pleora Technologies, based in Ottawa, delivers real-time video and data connectivity for machine vision and for security and defence applications. Siemens’ case study names Xpedition Enterprise, HyperLynx and Simcenter Flotherm, and lists “First-pass design success” as a result.

Source: Siemens, Pleora Technologies case study

Test, Industrial and Medical Electronics

NI: concurrent design across disciplines

Siemens’ NI case study describes analog, digital, RF, PCB and power supply experts working in concurrent Xpedition sessions, with SI/PI simulation in HyperLynx and DFM/DFX validation in Valor. Siemens lists the result as “Increased productivity and met time-to-market goals.”

Source: Siemens, National Instruments: Achieving productivity and time-to-market goals

Mindray: certified high-density medical boards

Mindray, headquartered in Shenzhen, designs IPC Class 3 boards for medical devices that must meet ISO 13485, FDA and CFDA requirements. Siemens’ case study centres on Xpedition for density and layout time, and lists “Increased design efficiency by 2X with less effort” among the results.

Source: Siemens, Mindray leverages Xpedition to overcome medical product innovation challenges

FANUC: design data management

FANUC’s case study is about Xpedition EDM for centralised management of design and component data, including responding when components are discontinued. Siemens writes that the streamlined process with Xpedition Enterprise achieved “approximately a 15% reduction in the PCB design process.”

Source: Siemens, FANUC utilizes Xpedition EDM

Semiconductor Packaging and Chiplets

Chipletz: Smart Substrate packaging

Chipletz, a start-up in Austin, Texas, develops Smart Substrate products for multi-chip packages. Siemens’ case study names Xpedition and HyperLynx and lists “Reduction of metal layers from 16 to 9” among the results.

Source: Siemens, Chipletz case study

ETRI and Amkor: chiplet-based AI NPU

The Electronics and Telecommunications Research Institute (ETRI) in Korea worked with Amkor Technology Korea as OSAT and design partner on a chiplet-based AI NPU. Siemens’ case study says they selected Xpedition Package Designer, Xpedition Substrate Integrator and Calibre 3DSTACK, and lists an “Integrated interposer and package substrate design flow” among the results.

Source: Siemens, ETRI and Amkor case study

Patterns Across the Stories

Reading the ten together, a few themes repeat in how Siemens describes the work:

Concurrent design. TESAT, NI and Abaco all emphasise several engineers working on one design at once in Xpedition.
Simulation during layout, not after. Leonardo, TESAT, NI, Abaco and Pleora pair Xpedition with HyperLynx signal and power integrity analysis.
Manufacturability checked before release. Leonardo, NI and Abaco add Valor DFM verification.
Data management as a design problem. FANUC and Unison are about managing libraries, components and ECAD-MCAD data, not routing.
Packaging is now a PCB-style problem. Chipletz and ETRI with Amkor use Xpedition packaging tools and Calibre on multi-die designs.

Where GSAS Fits for Indian Teams

GSAS Micro Systems is an authorized Siemens EDA partner in India and a value added distributor/reseller for Siemens EDA products. We have a dedicated FAE team ready to help you with custom built solutions matching your needs. The tools named in these stories that GSAS supplies in India are:

Xpedition Enterprise, Xpedition Advanced and Xpedition Standard for PCB design
HyperLynx for signal and power integrity
Valor NPI for DFM verification
Xpedition Package Designer for IC package design
Calibre for IC physical verification

Our engineers in Bengaluru, Hyderabad, Chennai, Pune, Mumbai and Delhi NCR run evaluations on your own designs, so you can test the claims in these stories against your boards rather than take them on trust.

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